Magnetic Memory Cell Including Two-Terminal Selector Device

ABSTRACT

The present invention is directed to a memory cell that includes a magnetic tunnel junction (MTJ) memory element and a two-terminal selector element coupled in series. The MTJ memory element includes a magnetic free layer structure and a magnetic reference layer structure with an insulating tunnel junction layer interposed therebetween. The magnetic reference layer structure includes one or more magnetic reference layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof. The two-terminal selector element includes a first inert electrode and a second inert electrode with a volatile switching layer interposed therebetween; a first active electrode formed adjacent to the first inert electrode; and a second active electrode formed adjacent to the second inert electrode. The volatile switching layer includes at least one conductor layer interleaved with insulating layers.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of the commonlyassigned application bearing Ser. No. 15/863,825 filed on Jan. 5, 2018by Yang et al., entitled “Magnetic Memory Cell Including Two-TerminalSelector Device,” which is a continuation-in-part of the commonlyassigned application bearing Ser. No. 15/438,631 filed on Feb. 21, 2017by Yang et al., entitled “Selector Device Having Asymmetric Conductancefor Memory Applications,” and a continuation-in-part of the commonlyassigned application bearing Ser. No. 15/157,607 filed on May 18, 2016by Yang et al., entitled “Selector Device Incorporating ConductiveClusters for Memory Applications.” The contents of all of theseapplications, including their specifications, are incorporated herein byreference in their entirety.

BACKGROUND

The present invention relates to a memory cell for data storageapplications, and more particularly, to embodiments of a memory cellincluding a magnetic tunnel junction (MTJ) memory element coupled to atwo-terminal selector device in series.

Spin transfer torque magnetic random access memory (STT-MRAM) is a newclass of non-volatile memory, which can retain the stored informationwhen powered off. A conventional STT-MRAM device normally comprises anarray of memory cells, each of which includes a magnetic memory elementand a selection transistor coupled in series between appropriateelectrodes. The selection transistor functions like a switch to directcurrent or voltage through the selected magnetic memory element coupledthereto. Upon application of a switching current through the magneticmemory element, the electrical resistance of the magnetic memory elementwould change accordingly, thereby switching the stored logic in therespective memory cell.

FIG. 1 is a schematic circuit diagram of a conventional magnetic memoryarray 20, which comprises a plurality of memory cells 22 with each ofthe memory cells 22 including a selection transistor 24 coupled to amagnetic memory element 26; a plurality of parallel word lines 27 witheach being coupled to the gates of a respective row of the selectiontransistors 24 in a first direction; a plurality of parallel bit lines28 with each being coupled to a respective row of the magnetic memoryelements 26 in a second direction substantially perpendicular to thefirst direction; and a plurality of parallel source lines 29 with eachbeing coupled to a respective row of the selection transistors 24 in thesecond direction.

The use of the two-terminal selector instead of transistor would allowthe memory cell to attain the minimum cell size of 4 F², where F denotesthe minimum feature size or one half the minimum pitch normallyassociated with a particular manufacturing process, thereby increasingmemory array density. However, conventional bidirectional two-terminalselector devices, such as Ovonic threshold switch (OTS), have relativelylow on/off ratio and are prone to current leakage compared withconventional selection transistors.

For the foregoing reasons, there is a need for a bidirectionaltwo-terminal selector device for memory applications that has highon/off switching speed and low current leakage and that can beinexpensively manufactured.

SUMMARY

The present invention is directed to a two-terminal selector thatsatisfies this need. A magnetic memory cell having features of thepresent invention comprises a magnetic tunnel junction (MTJ) memoryelement coupled to a bidirectional two-terminal selector element inseries. The MTJ memory element includes a magnetic free layer structureand a magnetic reference layer structure with an insulating tunneljunction layer interposed therebetween. The magnetic free layerstructure includes one or more magnetic free layers having a variablemagnetization direction substantially perpendicular to layer planesthereof. The magnetic reference layer structure includes one or moremagnetic reference layers having a first invariable magnetizationdirection substantially perpendicular to layer planes thereof. Thetwo-terminal selector element includes a first electrode structure and asecond electrode structure with a volatile switching layer structureinterposed therebetween. The volatile switching layer structure includesa plurality of metal-rich particles or clusters embedded in aninsulating matrix or at least one conductive layer interleaved withinsulating layers. The first and second electrode structures each mayinclude one or more electrode layers.

According to an aspect of the present invention, the volatile switchinglayer structure of the selector element is in contiguous contact with afirst and a second inert electrode layers. The selector element furtherincludes a first active electrode layer formed adjacent to the firstinert electrode layer opposite the volatile switching layer structureand a second active electrode layer formed adjacent to the second inertelectrode layer opposite the volatile switching layer structure.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings where:

FIG. 1 is a schematic circuit diagram for a conventional memory arraythat includes a plurality of magnetic memory cells with each cellincluding a magnetic memory element and a selection transistor coupledin series;

FIGS. 2A and 2B are schematic circuit diagrams showing embodiments of amemory array that includes a plurality of memory cells with each cellincluding a magnetic memory element and a two-terminal selector elementcoupled in series;

FIGS. 3A and 3B illustrate different schemes for selecting a memory cellfor sensing or programming;

FIGS. 4A and 4B illustrate schemes for programming a magnetic memorycell to low and high resistance states, respectively;

FIGS. 5A and 5B are exemplary I-V response plots for a bidirectionalselector element having symmetric conductance;

FIGS. 6A-6C are I-V response plots for a selector element, an MTJ memoryelement, and a memory cell comprising the selector element and the MTJmemory element coupled in series, respectively;

FIG. 7 is an exemplary I-V response plot for a bidirectional selectorelement having asymmetric conductance;

FIG. 8 is another exemplary I-V response plot for a bidirectionalselector element having asymmetric conductance;

FIG. 9A is an I-V response plot for an MTJ memory element havingsymmetric switching voltages;

FIG. 9B is an I-V response plot for a memory cell having symmetricswitching voltages;

FIG. 10 is a cross sectional view of a selector element structure inaccordance with an embodiment of the present invention;

FIGS. 11A-11C are cross sectional views of three exemplary structuresfor the volatile switching layer structure in the selector element ofFIG. 10;

FIGS. 12A-12C are cross sectional views of exemplary structures for avolatile switching layer structure having two, three, and four switchinglayers, respectively;

FIGS. 13A-13F are cross sectional views of exemplary structures for avolatile switching layer structure having two switching layers;

FIGS. 14A-14F are cross sectional views of exemplary structures for avolatile switching layer structure having three switching layers;

FIGS. 15A-15E are cross sectional views showing exemplary structures forthe first electrode structure of FIG. 10 having one, two, three, four,and five first electrode layers, respectively;

FIGS. 16A-16E are cross sectional views of exemplary structures for thesecond electrode structure of FIG. 10 having one, two, three, four, andfive second electrode layers, respectively;

FIGS. 17A-17D are cross sectional views of exemplary structures for amagnetic tunnel junction (MTJ) memory element in accordance with anembodiment of the present invention;

FIGS. 18A-18G are cross sectional views showing exemplary structures forthe magnetic free layer structure illustrated in FIGS. 17A-17D;

FIGS. 19A-19G are cross sectional views showing exemplary structures forthe magnetic reference layer structure illustrated in FIGS. 17A-17D;

FIGS. 20A-20G are cross sectional views showing exemplary structures forthe magnetic fixed layer structure illustrated in FIGS. 17A-17B;

FIGS. 21A-21G are cross sectional views showing exemplary structures forthe magnetic compensation layer structure illustrated in FIGS. 17C-17D;

FIGS. 22A-22D are cross sectional views showing exemplary multilayerstructures comprising one or more stacks of a bilayer unit structure;and

FIGS. 23A-23D are cross sectional views of exemplary magnetic memorycell structures formed by integrating the selector element of FIG. 10and variants of the MTJ memory element illustrated in FIGS. 17A-17D.

For purposes of clarity and brevity, like elements and components willbear the same designations and numbering throughout the Figures, whichare not necessarily drawn to scale.

DETAILED DESCRIPTION

In the following description, directional terms, such as “front,”“back,” “top,” “bottom,” and the like, may be used with reference to theorientation of the illustrated figure. Spatially relative terms, such as“beneath,” “below,” “under,” “lower,” “upper,” “above,” etc., may beused herein to describe one element's relationship to another element(s)as illustrated in the figure. Since articles and elements can bepositioned in a number of different orientations, these terms areintended for illustration purposes and in no way limit the invention.

Where reference is made herein to a material AB composed of element Aand element B, the material AB can be an alloy, a compound, or acombination thereof, with the atomic concentration of A or B ranges from0.1 to 99.9%, except where the context excludes that possibility.Similarly, a material ABC composed of elements A, B, and C may be analloy, a compound, or a combination thereof, with the atomicconcentration of each element in the range of 0.1 to 99.8%, except wherethe context excludes that possibility.

The term “noncrystalline” means an amorphous state or a state in whichfine crystals are dispersed in an amorphous matrix, not a single crystalor polycrystalline state. In case of state in which fine crystals aredispersed in an amorphous matrix, those in which a crystalline peak issubstantially not observed by, for example, X-ray diffraction can bedesignated as “noncrystalline.”

The term “at least” followed by a number is used herein to denote thestart of a range beginning with that number, which may be a range havingan upper limit or no upper limit, depending on the variable beingdefined. For example, “at least 1” means 1 or more than 1. The term “atmost” followed by a number is used herein to denote the end of a rangeending with that number, which may be a range having 1 or 0 as its lowerlimit, or a range having no lower limit, depending upon the variablebeing defined. For example, “at most 4” means 4 or less than 4, and “atmost 40%” means 40% or less than 40%. When, in this specification, arange is given as “(a first number) to (a second number)” or “(a firstnumber)-(a second number),” this means a range whose lower limit is thefirst number and whose upper limit is the second number. For example,“25 to 100 nm” means a range whose lower limit is 25 nm and whose upperlimit is 100 nm.

FIG. 2A is a schematic circuit diagram of a memory array 30, whichcomprises a plurality of memory cells 32 with each of the memory cells32 including a two-terminal selector element 34 coupled to a magneticmemory element 36 in series; a first plurality of parallel conductivelines 38A-C with each being coupled to a respective row of the magneticmemory elements 36 in a first direction; and a second plurality ofparallel conductive lines 40A-C with each being coupled to a respectiverow of the selector elements 34 in a second direction substantiallyperpendicular to the first direction. Accordingly, the memory cells 32are located at the cross points between the first and second pluralityof conductive lines 38A-C and 40A-C. The first and second plurality ofconductive lines 38A-C and 40A-C may be word lines and bit lines,respectively, or vice versa. The stacking order of the two-terminalselector elements 34 and the magnetic memory elements 36 may be invertedbetween the first and second plurality of conductive lines 38A-C and40A-C to form the memory cells 32′ shown in FIG. 2B. Multiple layers ofthe memory array 30 or 30′ may be stacked on a wafer substrate to form amonolithic three-dimensional memory device. Alternatively, alternatinglayers of the memory array 30 and the memory array 30′ may be stacked ona wafer substrate to form the three-dimensional memory device.

FIG. 3A illustrates a scheme for selecting a memory cell in the memoryarray 30 or 30′ for sensing or programming by turning on the selectorelement of the selected cell. The memory cell 32BB is selected byapplying a voltage, V, to one of the first conductive lines 38B coupledthereto, while grounding one of the second conductive lines 40Bconnected to the selected memory cell 32BB, thereby generating a netpotential difference of V across the memory cell 32BB. Meanwhile, tominimize current leakage and prevent accidental programming of theunselected memory cells, a voltage of about V/2 is applied to theunselected second conductive lines 40A, 40C-D and the unselected firstconductive lines 38A, 38C, resulting in a net potential difference ofV/2 across the unselected memory cells 32BA, 32AB, 32CB, 32DB, 32BC thatare coupled to either the selected first conductive line 38B or theselected second conductive line 40B. The cell voltage of V is greaterthan V_(th) to ensure that the selector element of the selected memorycell 32BB becomes conductive, while the cell voltage of V/2 is not highenough for the selector elements of the unselected memory cells 32BA,32BC, 32AB, 32CB, and 32DB to become conductive. The rest of theunselected memory cells 32AA, 32CA, 32DA, 32AC, 32CC, and 32DC that arenot connected to the selected first conductive line 38B or the selectedsecond conductive line 40B experience essentially no potential dropthereacross.

FIG. 3B illustrates an alternative scheme for selecting the memory cell32BB for sensing or programming. The memory cell 32BB is selected byapplying a first voltage, +V/2, to the first conductive line 38B coupledthereto and a second voltage, −V/2, to the second conductive line 40Bcoupled thereto, thereby generating a potential difference of V acrossthe memory cell 32BB. Meanwhile, the unselected second conductive lines40A, 40C-D and the unselected first conductive lines 38A, 38C aregrounded. The application of +V/2 to the selected first conductive line38B results in a net potential difference of V/2 across the unselectedmemory cells 32AB, 32CB, 32DB coupled thereto. Similarly, application of−V/2 to the selected second conductive line 40B results in a netpotential difference of V/2 across the unselected memory cells 32BA,32BC coupled thereto. The potential difference of V is greater thanV_(th) to ensure that the selector element of the memory cell 32BBbecomes conductive, while the potential difference of V/2 is not highenough for the selector elements of the unselected memory cells 32BA,32BC, 32AB, 32CB, and 32DB to become conductive. The rest of theunselected memory cells 32AA, 32CA, 32DA, 32AC, 32CC, and 32DC that arenot connected to the selected first conductive line 38B or the selectedsecond conductive line 40B experience essentially no potential dropthereacross.

Referring back to FIGS. 2A and 2B, the magnetic memory element 36normally includes a magnetic reference layer and a magnetic free layerwith an electron tunnel junction layer interposed therebetween. Themagnetic reference layer, the electron tunnel junction layer, and themagnetic free layer collectively form a magnetic tunnel junction (MTJ).Upon the application of an appropriate current through the MTJ, themagnetization direction of the magnetic free layer can be switchedbetween two directions: parallel (same) and anti-parallel (opposite)with respect to the magnetization direction of the magnetic referencelayer. The electron tunnel junction layer is normally made of aninsulating material with a thickness ranging from a few to a few tens ofangstroms. When the magnetization directions of the magnetic free andreference layers are substantially parallel or oriented in a samedirection, electrons polarized by the magnetic reference layer cantunnel through the insulating tunnel junction layer, thereby decreasingthe electrical resistance of the MTJ. Conversely, the electricalresistance of the MTJ is high when the magnetization directions of themagnetic reference and free layers are substantially anti-parallel ororiented in opposite directions. The stored logic in the magnetic memoryelement can be switched by changing the magnetization direction of themagnetic free layer between parallel and anti-parallel orientations withrespect to the magnetization direction of the reference layer.Therefore, the MTJ has two stable resistance states that allow the MTJto serve as a non-volatile memory element.

Based on the relative orientation between the magnetic reference andfree layers and the magnetization directions thereof, an MTJ can beclassified into one of two types: in-plane MTJ, the magnetizationdirections of which lie substantially within planes parallel to the samelayers, or perpendicular MTJ, the magnetization directions of which aresubstantially perpendicular to the layer planes.

FIGS. 4A and 4B illustrate the programming operations for an STT-MRAMcell including a perpendicular MTJ memory element 80 coupled to atwo-terminal selector element 82 in series. The MTJ memory element 80includes a magnetic reference layer 84 having an invariable or fixedmagnetization direction 86 perpendicular to the layer plane thereof, amagnetic free layer 88 having a variable magnetization direction 90 or96 perpendicular to the layer plane thereof, and a tunnel junction layer92 interposed therebetween.

FIG. 4A illustrates the writing or programming process for switching theresistance state of the MTJ memory element 80 from high to low. Aselectrons that pass through the magnetic reference layer 84 are beingspin-polarized, the spin-polarized electrons exert a spin transfertorque on the magnetic free layer 88. When the spin-polarized current orparallelizing current (i^(p)) 98 exceeds a threshold level, the magneticfree layer 88 switches from the anti-parallel to parallel magnetizationdirection 90 with respect to the fixed magnetization direction 86 of themagnetic reference layer 84. It should be noted that the parallelizingwrite current (i^(p)) 98 flows in the opposite direction as theelectrons.

Conversely, FIG. 4B illustrates the writing process for switching theresistance state of the MTJ memory element 80 from low to high. Aselectrons pass through the magnetic free layer 88, the electrons withthe same spin direction as that of the magnetization in the magneticreference layer 84 pass into the magnetic reference layer 84 unimpeded.However, the electrons with the opposite spin direction are reflectedback to the magnetic free layer 88 at the boundary between the tunneljunction layer 92 and the magnetic reference layer 84, causing themagnetization direction 96 of the magnetic free layer 88 to switch fromthe parallel to anti-parallel orientation when the anti-parallelizingcurrent (i^(ap)) 100 exceeds a threshold level.

FIG. 5A shows an exemplary current-voltage (I-V) response plot for abidirectional two-terminal selector element in accordance with anembodiment of the present invention. The I-V response curve 110 showsthe magnitude of electric current passing through the two-terminalselector element as the voltage applied thereto varies. Initially, thecurrent slightly increases with the applied voltage from zero to near athreshold voltage, V_(th). At or near V_(th), the current rapidlyincreases and exhibits a highly non-linear exponential behavior,indicating a transition of the selector element from a nominallyinsulative or “off” state to a nominally conductive or “on” state. Asthe selector voltage continues to increase beyond V_(th), the currentincrease becomes gradual until reaching V_(P), which may be theprogramming voltage required to drive a switching current through amagnetic memory element coupled to the selector element. The currentresponse behaves like a step function as the applied voltage increasesfrom zero to V_(P) with the sharp increase occurring at or near V_(th),which may be about 60-80% of V_(P). As previously shown in FIGS. 3A and3B, during the programming operation, the unselected memory cellscoupled to either the selected word line or the selected bit line aresubjected to a net applied voltage equivalent to about half theprogramming voltage. Therefore, the leakage current, I_(leak), for theselector element in the “off” state is measured at the selector voltageof V_(P)/2. The ratio of I_(on), which is the selector current at V_(P),to I_(leak) measured at V_(P)/2 is sometimes referred to as “on/offratio.”

With continuing reference to FIG. 5A, as the selector voltage decreasesfrom V_(P) to near a holding voltage, V_(hold), which is lower thanV_(th), the selector current gradually decreases and the selectorelement remains in the highly conductive state. At or near V_(hold), thecurrent rapidly decreases and exhibits a highly non-linear behavior,indicating a transition from the nominally conductive state back to thenominally insulative state. As the voltage continues to decrease beyondV_(hold), the current flow slightly decreases until stopping at about 0V. Therefore, the selector element requires the continuing applicationof a voltage to be conductive and is therefore a volatile device.

The I-V response curve 110 of the selector behaves like a hysteresisloop. The nominally insulating selector element turns on or becomesconductive when the selector voltage exceeds V_(th). Once in theconductive state, the selector element will stay on or remain conductiveuntil the selector voltage dropping below V_(hold), which is less thanV_(th). In a conventional write or programming operation, the selectorelement may be first turned on by raising the selector voltage to aboutV_(th). The selector voltage may then be further increased to a higherlevel V_(P) that is sufficient to drive a current I_(on) for switchingthe resistance state of the magnetic memory element. In a conventionalread or sensing operation, the selector element may be first turned onby raising the selector voltage to about V_(th). The selector voltage isthen decreased to a level between V_(th) and V_(hold) to minimize “readdisturbance” while ensuring that the selector element is sufficientlyconductive to allow a sensing current to pass therethrough fordetermining the resistance state of the magnetic memory element.

The two-terminal selector element characterized by the I-V response plotof FIG. 5A is bidirectional as the polarity of the selector voltage maybe reversed from zero to Fp as shown. The I-V response curve 110′corresponding to the opposite polarity may be substantially similar tothe curve 110 described above. The two response curves 110 and 110′ forthe selector element are therefore substantially “symmetric” withrespect to the current (vertical) axis at Selector Voltage=0.

A bidirectional selector element may alternatively have an I-V responseshown in FIG. 5B. The I-V response plot of FIG. 5B differs from the I-Vresponse plot of FIG. 5A in that after the selector element is turned onat V_(th), the current remains substantially constant with continuouslyincreasing selector voltage or decreasing selector voltage untilreaching V_(hold), below which the selector element is turned off. Theconstant current is sometimes referred to as “compliance current”(I_(cc)).

FIGS. 6A-6C show I-V response plots for a two-terminal selector element,an MTJ memory element, and a memory cell comprising the two-terminalselector element and the MTJ memory element coupled in series,respectively. The I-V response plot of FIG. 6A shows the magnitude ofelectric current passing through the two-terminal selector element asthe voltage applied thereto varies between +0.6 and −0.6 V. As theapplied voltage increases from 0 to 0.6 V, the selector element turns onor becomes substantially conductive at about 0.17 V (threshold voltage),which is characterized by the rapid increase in the current passingthrough the selector element. At the selector voltage of about 0.2 V,the selector current reaches a maximum value of about 100 μA (compliancecurrent) and remains at essentially the same level until 0.6 V. As theselector voltage decreases from 0.6 to 0 V, the selector current remainsat about 100 μA until about 0.1 V (holding voltage), below which theselector current rapidly drops off to indicate the selector elementbecoming nominally insulative again. As the polarity of the appliedvoltage to the selector element is reversed (i.e. between 0 and −0.6 V),the current flow is reversed and reaches a maximum value of about 100 μA(compliance current) at about −0.2 V and beyond. The selector currentstays at the maximum level as the selector voltage varies from −0.6 toabout −0.1 V (holding voltage), beyond which the selector currentrapidly drops off. The I-V response curve of the selector element in thenegative voltage region is analogous to that in the positive voltageregion with the two curves being substantially symmetric with respect toa vertical axis at Selector Voltage=0 (not shown).

FIG. 6B shows the magnitude of electric current passing through the MTJmemory element as the voltage applied thereto varies between +0.5 and−0.5 V. As the applied voltage to the MTJ memory element increases from0 to 0.5 V, the current passing through the MTJ memory elementcontinually increases but with an abrupt drop at about 0.28 V (switchingvoltage), indicating the transition from low to high resistance state.Further increase in the voltage does not change the resistance state. Asthe polarity of the voltage applied to the MTJ memory element isreversed (i.e. 0 to −0.5 V), the current through the MTJ memory elementcontinually increases and experiences an abrupt jump at about −0.25 V(switching voltage), indicating the transition from high to lowresistance state. Therefore, the I-V response plot of FIG. 6B shows theMTJ memory element having relatively symmetric switching voltages.

FIG. 6C shows the magnitude of electric current passing through thememory cell as the voltage applied thereto varies between +0.6 and −0.6V. The memory cell includes the selector element having the I-V responseshown in FIG. 6A and the MTJ memory element having the I-V responseshown in FIG. 6B coupled in series. Since the voltage is applied to thememory cell at two ends thereof via two conductive lines as shown inFIGS. 2A and 2B, only the memory cell voltage is controlled, not theindividual selector voltage or MTJ voltage. While the selector elementand the MTJ memory element individually show relatively symmetric on/offor switching behavior, the memory cell formed by the selector elementand the MTJ memory element coupled in series may exhibit asymmetricswitching behavior. For example, FIG. 6C shows the MTJ memory elementhaving switching voltages of about 0.49 (low to high resistance) and0.32 V (high to low resistance), a difference of 0.17 V, when coupled tothe selector element. The asymmetric switching behavior of the MTJmemory element in the memory cell may be due to the difference in thenet or effective voltage that the MTJ memory element experiences whenthe same element is in different resistance states. When a voltage isapplied to the memory cell, the net or effective voltage on the MTJmemory element will be lower when the MTJ memory element is in the lowresistance state compared with the high resistance state. Therefore, ahigher memory cell voltage (−0.49 V) may be required to switch the MTJmemory element from the low to high resistance state.

Since the capacity of the power supply for a memory circuit is mostlydictated by the programming voltage or current used in the programmingoperation, it may be desirable to balance the switching voltages of thememory cell to reduce the power supply voltage and to minimize powerconsumption. Moreover, the balancing of the switching voltages mayprevent unintended high to low resistance switching when the selectorelement is turn on for a sense or read operation because the closeproximity between the selector turn-on voltage and the MTJ switchingvoltage as shown in FIG. 6C.

The switching voltages of a memory cell made of an MTJ memory elementand a selector element coupled in series may be balanced by modifyingthe switching behavior of the MTJ memory element to be asymmetric and/ormodifying the I-V response of the selector element to be asymmetric.

Accordingly, an embodiment of the present invention as applied to amemory cell includes an MTJ memory element coupled to a selector elementwith asymmetric I-V response. FIG. 7 shown an exemplary I-V responseplot for the asymmetric selector element without a load coupled thereto.In an embodiment, the two I-V response curves 114 and 116 correspond tothe directions of parallelizing (high to low MTJ resistance) andanti-parallelizing (low to high MTJ resistance) currents, respectively.As explained above and illustrated in FIGS. 4A and 4B, the parallelizingcurrent (i^(p)) flows in the direction from the free layer to thereference layer, while the anti-parallelizing current (i^(op)) flows inthe opposite direction. The I-V response curves 114 and 116 of FIG. 7show the selector element in the conductive state having a higherselector current in the direction of anti-parallelizing current than inthe direction of parallelizing current at the same absolute selectorvoltage. Therefore, the selector element in the conductive (“on”) statehas a higher conductance or lower resistance in the direction ofanti-parallelizing current than in the direction of parallelizingcurrent.

With continuing reference to the I-V response plot of FIG. 7, thethreshold voltages (absolute values) V_(th) and V′_(th) of theasymmetric selector element in the anti-parallelizing and parallelizingcurrent directions, respectively, may be different or substantially thesame. In an embodiment, V_(th) is greater than V′_(th). In analternative embodiment, V′_(th) is greater than V_(th). Similarly, theholding voltages (absolute values) V_(hold) and V′_(hold) in theanti-parallelizing and parallelizing current directions, respectively,may be different or substantially the same. In an embodiment, V_(hold)is greater than V′_(hold). In an alternative embodiment, V′_(hold) isgreater than V_(hold). The I-V slopes in the nominally insulative(“off”) state along the anti-parallelizing and parallelizing currentdirections, respectively, may be different or substantially the same. Inan embodiment, the I-V slope in the nominally insulative state along theanti-parallelizing current direction is greater than that along theparallelizing current direction. In an alternative embodiment, the I-Vslope in the nominally insulative state along the parallelizing currentdirection is greater than that along the anti-parallelizing currentdirection. Analogously, the I-V slopes in the conductive (“on”) statealong the anti-parallelizing and parallelizing current directions,respectively, may be different or substantially the same. In anembodiment, the I-V slope in the conductive state along theanti-parallelizing current direction is greater than that along theparallelizing current direction. In an alternative embodiment, the I-Vslope in the conductive state along the parallelizing current directionis greater than that along the anti-parallelizing current direction.

In alternative embodiments, the two I-V response curves 114 and 116correspond to the directions of anti-parallelizing (low to high MTJresistance) and parallelizing (high to low MTJ resistance) currents,respectively.

The selector element with asymmetric I-V response may alternativelyexhibit the exemplary I-V response curves 118 and 120 shown in FIG. 8.The I-V response plot of FIG. 8 is analogous to the plot of FIG. 7except that the selector currents I_(cc) and I′_(cc) in the conductivestate along the anti-parallelizing and parallelizing current directions,respectively, remain relatively constant with selector voltage. Theselector current (I_(cc)) in the conductive state along the direction ofthe anti-parallelizing current is higher than the selector current(I′_(cc)) along the direction of parallelizing current. Therefore, theselector element in the conductive (“on”) state has a higher conductanceor lower resistance in the direction of anti-parallelizing current thanin the direction of parallelizing current.

In alternative embodiments, the two I-V response curves 118 and 120correspond to the directions of anti-parallelizing (low to high MTJresistance) and parallelizing (high to low MTJ resistance) currents,respectively.

In an embodiment of the present invention, the applied voltages to thememory cell, which includes the selector element exhibiting theasymmetric I-V response characteristics shown and described withreference to FIG. 7 or FIG. 8, for switching the resistance of the MTJmemory element from the low to high state (V_(CS)) and from the high tolow state (V′_(CS)), respectively, are substantially the same as shownin FIG. 9B. In another embodiment, the switching voltages of the MTJmemory element from the low to high state (V_(MS)) and from the high tolow state (V′_(MS)), respectively, are substantially the same as shownin FIG. 9B. In another embodiment, the memory cell with substantiallysymmetric cell switching voltages (V_(CS) and V′_(CS)) as shown in FIG.9B includes the MTJ memory element exhibiting substantially symmetricmemory switching voltages (V_(MS) and V′_(MS)) as shown in FIG. 9Acoupled to the selector element exhibiting the asymmetric I-V responseas shown and described with reference to FIG. 7 or FIG. 8.

An embodiment of the present invention as applied to a two-terminalselector element 122 will now be described with reference to FIG. 10.Referring now to FIG. 10, the illustrated selector element 122 includesa first electrode structure 124 and a second electrode structure 126with a volatile switching layer structure 128 interposed therebetween.

The volatile switching layer structure 128, which may include one ormore distinct volatile switching layers, behaves like a volatile devicethat is nominally insulative in the absence of an applied voltage orcurrent. Upon continuing application of a switching voltage or current,however, the volatile switching layer structure 128 becomes conductive.In an embodiment illustrated in FIG. 11A, the volatile switching layerstructure 128 includes a homogeneous layer 128 a made of a nominallyinsulating material or any suitable material that switches itsresistance in the presence of an applied field or current, such as butnot limited to SiO_(x), SiN_(x), AlO_(x), MgO_(x), TaO_(x), VO_(x),NbO_(x), TiO_(x), WO_(x), HfO_(x), ZrO_(x), NiO_(x), FeO_(x), YO_(x),EuO_(x), SrO_(x), AsO_(x), SbO_(x), SnO_(x), InO_(x), SeO_(x), GaO_(x),CeO_(x), TeO_(x), CuGe_(x)S_(y), CuAg_(x)Ge_(y)S_(z,) GeSb_(x)Te_(y),AgIn_(x)Sb_(y)Te_(z), GeTe_(x), SbTe_(x), GeSb_(x), CrO_(x),SrTi_(x)O_(y), YZr_(x)O_(y), LaF_(x), AgI_(x), CuI_(x), RbAg_(x)I_(y),or any combination thereof. The exemplary compounds may bestoichiometric or non-stoichiometric. The homogeneous layer 128 a mayfurther include one or more dopant or alloying elements, such as but notlimited to Ag, Au, Zn, Sn, Ni, As, and Cu.

Alternatively, the volatile switching layer structure 128 may include acomposite layer 128 b comprising a plurality of metal-rich particles orclusters 130 embedded in a nominally insulating matrix 132 asillustrated in FIG. 11B. The nominally insulating matrix 132 may be madeof any suitable material, such as but not limited to SiO_(x), SiN_(x),AlO_(x), MgO_(x), TaO_(x), VO_(x), NbO_(x), TiO_(x), WO_(x), HfO_(x),ZrO_(x), NiO_(x), FeO_(x), YO_(x), EuO_(x), SrO_(x), AsO_(x), SbO_(x),SnO_(x), InO_(x), SeO_(x), GaO_(x), CeO_(x), TeO_(x), CuGe_(x)S_(y),CuAg_(x)Ge_(y)S_(z), GeSb_(x)Te_(y), AgIn_(x)Sb_(y)Te_(z), GeTe_(x),SbTe_(x), GeSb_(x), CrO_(x), SrTi_(x)O_(y), YZr_(x)O_(y), LaF_(x),AgI_(x), CuI_(x), RbAg_(x)I_(y), or any combination thereof. Theexemplary compounds may be stoichiometric or non-stoichiometric.

With continuing reference to FIG. 11B, the plurality of metal-richparticles or clusters 130 may be made of a relatively inert metal, or analloy including one or more inert metals, or a fast electric fieldenhanced diffuser material, or any combination thereof. Examples of theinert metal include gold (Au), silver (Ag), platinum (Pt), palladium(Pd), rhodium (Rh), iridium (Ir), ruthenium (Ru), osmium (Os), rhenium(Re), and any combinations thereof. Examples of the fast electric fieldenhanced diffuser material include nickel (Ni), copper (Cu), silver(Ag), gold (Au), zinc (Zn), cobalt (Co), iron (Fe), tungsten (W),molybdenum (Mo), tantalum (Ta), niobium (Nb), aluminum (Al), titanium(Ti), zirconium (Zr), arsenic (As), titanium nitride (TiN_(x)),zirconium nitride (ZrN_(x)), tantalum nitride (TaN_(x)), niobium nitride(NbN_(x)), tungsten nitride (WN_(x)), and any combinations thereof. Theexemplary nitrides may be stoichiometric or non-stoichiometric. In anembodiment, the concentration of the plurality of metal-rich particlesor clusters 130 in the matrix 132 decreases along the direction of theanti-parallelizing current.

The composite layer structure 128 b shown in FIG. 11B may be fabricatedby co-sputtering, whereby the target for the plurality of metal-richparticles or clusters 130 and the target for the insulating matrix 132are sputtered at the same time. Alternatively, the composite layerstructure 128 b may be fabricated by alternating sputter deposition ofmaterials corresponding to the metal-rich particles or clusters 130 andthe insulating matrix 132. The sputter-deposited film by both methodsmay subsequently subjected to an annealing process to enhance thediffusion or precipitation of the metal-rich particles or clusters 130.

Still alternatively, the volatile switching layer structure 128 may havea multilayer structure 128 c comprising one or more conductive layers134 interleaved with two or more insulating layers 136 as illustrated inFIG. 11C. The conductive layers 134 may be made of any of the suitableconductive materials described above for the metal-rich particles orclusters 130. The thickness of the conductive layers 134 may range fromseveral angstroms to several nanometers. In some cases where theconductive layers 134 are extremely thin, one or more of the conductivelayers 134 may be punctured by holes, thereby rendering the layercoverage to be discontinuous in some regions. Similarly, the nominallyinsulating layers 136 may be made of any of the suitable insulatingmaterials described above for the matrix 132. In an embodiment, thethicknesses of the conductive layers 134 decrease and/or the thicknessesof the insulating layers 136 increase along the direction of theanti-parallelizing current.

The volatile switching layer structure 128 may alternatively include twoor more volatile switching layers with each switching layer being ahomogenous layer 128 a, a composite layer 128 b, or a multilayerstructure 128 c. FIGS. 12A-12C illustrate the volatile switching layersstructure 128 including two, three, and four switching layers,respectively.

Some examples of the volatile switching layer structure 128 having twoswitching layers are illustrated in FIGS. 13A-13F. FIG. 13A shows anexemplary structure having two homogenous layers 128 a, which may bemade of different materials and/or having different dopants if present.FIG. 13B shows another exemplary structure including a homogenous layer128 a and a composite layer 128 b. In an embodiment, the homogenouslayer 128 a and the matrix 132 of the composite layer 128 b are made ofthe same material. In an alternative embodiment, the homogenous layer128 a and the matrix 132 of the composite layer 128 b are made ofdifferent materials. FIG. 13C shows still another exemplary structureincluding a homogenous layer 128 a and a multilayer structure 128 c. Inan embodiment, the homogenous layer 128 a and the insulating layers 136of the multilayer structure 128 c are made of the same material. In analternative embodiment, the homogenous layer 128 a and the insulatinglayers 136 of the multilayer structure 128 c are made of differentmaterials. FIG. 13D shows yet another exemplary structure including twocomposite layer 128 b, which may have different materials for the matrix132 and/or different materials for the metal-rich particles or clusters130. FIG. 13E shows still yet another exemplary structure including acomposite layer 128 b and a multilayer structure 128 c. The matrix 132of the composite layers 128 b and the insulating layers 136 of themultilayer structure 128 c may be made of the same material or differentmaterials. Likewise, the metal-rich particles or clusters 130 of thecomposite layer 128 b and the conductive layers 134 of the multilayerstructure 128 c may be made of the same material or different materials.FIG. 13F shows yet still another exemplary structure including twomultilayer structures 128 c, which may have different materials for theinsulating layers 136 and/or different materials for the conductivelayers 134. Moreover, the stacking order of the volatile switchinglayers in the exemplary structures illustrated in FIGS. 13A-13F may beinverted.

Some examples of the volatile switching layer structure 128 having threeswitching layers are illustrated in FIGS. 14A-14F. FIG. 14A shows anexemplary structure including two homogenous layers 128 a with acomposite layer 128 b interposed therebetween. The two homogenous layers128 a may be made of the same material or different materials. Thematrix 132 of the composite layer 128 b and at least one of the twohomogeneous layers 128 a may be made of the same material.Alternatively, the matrix 132 of the composite layer 128 b may be madeof a different material from the two homogeneous layers 128 a.

FIG. 14B shows another exemplary structure including two compositelayers 128 b with a homogeneous layer 128 a interposed therebetween. Thematrices 132 of the two composite layers 128 b may be made of the samematerial or different materials. The metal-rich particles or clusters130 of the two composite layers 128 b may be made of the same materialor different materials. The homogeneous layer 128 a and at least one ofthe two matrices 132 of the two composite layers 128 b may be made ofthe same material. Alternatively, the homogeneous layer 128 a may bemade of a different material from the two matrices 132 of the twocomposite layers 128 b.

FIG. 14C illustrates still another exemplary structure including twohomogenous layers 128 a with a multilayer structure 128 c interposedtherebetween. The two homogenous layers 128 a may be made of the samematerial or different materials. The insulating layers 136 of themultilayer structure 128 c and at least one of the two homogeneouslayers 128 a may be made of the same material. Alternatively, theinsulating layers 136 of the multilayer structure 128 c may be made of adifferent material from the two homogeneous layers 128 a.

FIG. 14D illustrates yet another exemplary structure including twomultilayer structures 128 c with a homogeneous layer 128 a interposedtherebetween. The insulating layers 136 of the two multilayer structures128 c may be made of the same material or different materials. Likewise,the conductive layers 134 of the two multilayer structures 128 c may bemade of the same material or different materials. The homogeneous layer128 a and at least one of the two stacks of insulating layers 136 of thetwo multilayer structures 128 c may be made of the same material.Alternatively, the homogeneous layer 128 a may be made of a differentmaterial from the insulating layers 136 of the two multilayer structures128 c.

FIG. 14E shows still yet another exemplary structure including acomposite layer 128 b and a multilayer structure 128 c with ahomogeneous layer 128 a interposed therebetween. The matrix 132 of thecomposite layer 128 b and the insulating layers 136 of the multilayerstructure 128 c may be made of the same material or different materials.The metal-rich particles or clusters 130 of the composite layer 128 band the conductive layers 134 of the multilayer structure 128 c may bemade of the same material or different materials. The homogeneous layer128 a and at least one of the matrix 132 of the composite layer 128 band the insulating layers 136 of the multilayer structure 128 c may bemade of the same material. Alternatively, the homogeneous layer 128 amay be made of a different material from the matrix 132 of the compositelayer 128 b and the insulating layers 136 of the multilayer structure128 c.

FIG. 14F illustrates yet still another exemplary structure includingthree homogeneous layers 128 a. The three homogeneous layers 128 a maybe made of different materials and/or have different dopants if present.In an embodiment, the interposing homogenous layer 128 a is made of adifferent material from the two peripheral homogeneous layers 128 a,which may be made of the same material and/or have the same dopant ifpresent.

The stacking order of the volatile switching layers in the exemplarystructures illustrated in FIGS. 14A-14F may be inverted.

Referring back to FIG. 10, the first electrode structure 124 and thesecond electrode structure 126 of the selector element 122 each mayinclude one or more electrode layers. FIGS. 15A-15E show partial viewsof the selector element 122 including the volatile switching layerstructure 128 and various exemplary structures for the first electrodestructure 124.

FIG. 15A illustrates an exemplary structure for the first electrodestructure 124 that includes a first electrode layer 124 a formedadjacent to the volatile switching layer structure 128.

FIG. 15B illustrates another exemplary structure for the first electrodestructure 124 that includes the first electrode layer 124 a formedadjacent to the volatile switching layer structure 128 and a secondelectrode layer 124 b formed adjacent to the first electrode layer 124 aopposite the volatile switching layer structure 128.

FIG. 15C illustrates still another exemplary structure for the firstelectrode structure 124 that includes the first electrode layer 124 aformed adjacent to the volatile switching layer structure 128, thesecond electrode layer 124 b formed adjacent to the first electrodelayer 124 a opposite the volatile switching layer structure 128, and athird electrode layer 124 c formed adjacent to the second electrodelayer 124 b opposite the first electrode layer 124 a.

FIG. 15D illustrates yet another exemplary structure for the firstelectrode structure 124 that includes the first electrode layer 124 aformed adjacent to the volatile switching layer structure 128, thesecond electrode layer 124 b formed adjacent to the first electrodelayer 124 a opposite the volatile switching layer structure 128, thethird electrode layer 124 c formed adjacent to the second electrodelayer 124 b opposite the first electrode layer 124 a, and a fourthelectrode layer 124 c formed adjacent to the third electrode layer 124 copposite the second electrode layer 124 b.

FIG. 15E illustrates still yet another exemplary structure for the firstelectrode structure 124 that includes the first electrode layer 124 aformed adjacent to the volatile switching layer structure 128, thesecond electrode layer 124 b formed adjacent to the first electrodelayer 124 a opposite the volatile switching layer structure 128, thethird electrode layer 124 c formed adjacent to the second electrodelayer 124 b opposite the first electrode layer 124 a, the fourthelectrode layer 124 c formed adjacent to the third electrode layer 124 copposite the second electrode layer 124 b, and a fifth electrode layer124 e formed adjacent to the fourth electrode layer 124 c opposite thethird electrode layer 124 c.

The first, second, third, fourth, and fifth electrode layers 124 a-124 eof the first electrode structure 124 each may include one or more of thefollowing elements: Au, Ag, Cu, Pt, Pd, Ni, Ir, Rh, Co, Os, Ru, Fe, Re,Mn, W, Mo, Cr, Ta, Nb, V, Hf, Zr, Ti, Mg, Zn, Cd, In, Ga, Al, B, Pb, Sn,Ge, Si, C, Bi, Sb, As, N, Te, Se, and O to form a suitable conductormaterial, such as but not limited to Au, Ag, Pt, Pd, Rh, Ir, Ru, Re, Si,Ni, NiSi_(x), NiCr_(x), Cu, CuSi_(x), CuGe_(x), CuAl_(x), CuN_(x), Co,CoSi_(x), CoCr_(x), Zn, ZnN_(x), Fe, FeNi_(x)Cr_(y), Cr, CrSi_(x)Al,AlN_(x), Ti, TiSi_(x), TiN_(x), Ta, TaSi_(x), TaN_(x), W, WSi_(x),WN_(x), Mo, MoSi_(x), MoN_(x), Zr, ZrSi_(x), ZrN_(x), Hf, HfSi_(x),HfN_(x), Nb, NbSi_(x), NbN_(x), V, VSi_(x), VN_(x), TiAl_(x), NiAl_(x),CoAl_(x), or any combination thereof.

One or more of the first, second, third, fourth, and fifth electrodelayers 124 a-124 e of the first electrode structure 124 each mayalternatively have a multilayer structure formed by interleaving one ormore layers of a first material with one or more layers of a secondmaterial. The first and second materials each may include one or more ofthe following elements: Au, Ag, Cu, Pt, Pd, Ni, Ir, Rh, Co, Os, Ru, Fe,Re, Mn, W, Mo, Cr, Ta, Nb, V, Hf, Zr, Ti, Mg, Zn, Cd, In, Ga, Al, B, Pb,Sn, Ge, Si, C, Bi, Sb, As, N, Te, Se, and O to form a suitableconductive material, such as but not limited to Au, Ag, Pt, Pd, Rh, Ir,Ru, Re, Si, Ni, NiSi_(x), NiCr_(x), Cu, CuSi_(x), CuGe_(x), CuAl_(x),CuN_(x), Co, CoSi_(x), CoCr_(x), Zn, ZnN_(x), Fe, FeNi_(x)Cr_(y), Cr,CrSi_(x), Al, AlN_(x), Ti, TiSi_(x), TiN_(x), Ta, TaSi_(x), TaN_(x), W,WSi_(x), WN_(x), Mo, MoSi_(x), MoN_(x), Zr, ZrSi_(x), ZrN_(x), Hf,HfSi_(x), HfN_(x), Nb, NbSi_(x), NbN_(x), V, VSi_(x), VN_(x), TiAl_(x),NiAl_(x), CoAl_(x), or any combination thereof.

FIGS. 16A-16E show partial views of the selector element 122 includingthe volatile switching layer structure 128 and various exemplarystructures for the second electrode structure 126. FIG. 16A illustratesan exemplary structure for the second electrode structure 126 thatincludes a first electrode layer 126 a formed adjacent to the volatileswitching layer structure 128.

FIG. 16B illustrates another exemplary structure for the secondelectrode structure 126 that includes the first electrode layer 126 aformed adjacent to the volatile switching layer structure 128 and asecond electrode layer 126 b formed adjacent to the first electrodelayer 126 a opposite the switching layer structure 128.

FIG. 16C illustrates still another exemplary structure for the secondelectrode structure 126 that includes the first electrode layer 126 aformed adjacent to the volatile switching layer structure 128, thesecond electrode layer 126 b formed adjacent to the first electrodelayer 126 a opposite the volatile switching layer structure 128, and athird electrode layer 126 c formed adjacent to the second electrodelayer 126 b opposite the first electrode layer 126 a.

FIG. 16D illustrates yet another exemplary structure for the secondelectrode structure 126 that includes the first electrode layer 126 aformed adjacent to the volatile switching layer structure 128, thesecond electrode layer 126 b formed adjacent to the first electrodelayer 126 a opposite the volatile switching layer structure 128, thethird electrode layer 126 c formed adjacent to the second electrodelayer 126 b opposite the first electrode layer 126 a, and a fourthelectrode layer 126 d formed adjacent to the third electrode layer 126 copposite the second electrode layer 126 b.

FIG. 16E illustrates still yet another exemplary structure for thesecond electrode structure 126 that includes the first electrode layer126 a formed adjacent to the volatile switching layer structure 128, thesecond electrode layer 126 b formed adjacent to the first electrodelayer 126 a opposite the volatile switching layer structure 128, thethird electrode layer 126 c formed adjacent to the second electrodelayer 126 b opposite the first electrode layer 126 a, the fourthelectrode layer 126 d formed adjacent to the third electrode layer 126 copposite the second electrode layer 126 b, and a fifth electrode layer126 e formed adjacent to the fourth electrode layer 126 d opposite thethird electrode layer 126 c.

The first, second, third, fourth, and fifth electrode layers 126 a-126 eof the second electrode structure 126 each may include one or more ofthe following elements: Au, Ag, Cu, Pt, Pd, Ni, Ir, Rh, Co, Os, Ru, Fe,Re, Mn, W, Mo, Cr, Ta, Nb, V, Hf, Zr, Ti, Mg, Zn, Cd, In, Ga, Al, B, Pb,Sn, Ge, Si, C, Bi, Sb, As, N, Te, Se, and O to form a suitableconductive material, such as but not limited to Au, Ag, Pt, Pd, Rh, Ir,Ru, Re, Si, Ni, NiSi_(x), NiCr_(x), Cu, CuSi_(x), CuGe_(x), CuAl_(x),CuN_(x), Co, CoSi_(x), CoCr_(x), Zn, ZnN_(x), Fe, FeNi_(x)Cr_(y), Cr,CrSi_(x) Al, AlN_(x), Ti, TiSi_(x), TiN_(x), Ta, TaSi_(x), TaN_(x), W,WSi_(x), WN_(x), Mo, MoSi_(x), MoN_(x), Zr, ZrSi_(x), ZrN_(x), Hf,HfSi_(x), HfN_(x), Nb, NbSi_(x), NbN_(x), V, VSi_(x), VN_(x), TlAl_(x),NiAl_(x), CoAl_(x), or any combination thereof.

One or more of the first, second, third, fourth, and fifth electrodelayers 126 a-126 e of the second electrode structure 126 each mayalternatively have a multilayer structure formed by interleaving one ormore layers of a first material with one or more layers of a secondmaterial. The first and second materials each may include one or more ofthe following elements: Au, Ag, Cu, Pt, Pd, Ni, Ir, Rh, Co, Os, Ru, Fe,Re, Mn, W, Mo, Cr, Ta, Nb, V, Hf, Zr, Ti, Mg, Zn, Cd, In, Ga, Al, B, Pb,Sn, Ge, Si, C, Bi, Sb, As, N, Te, Se, and O to form a suitableconductive material, such as but not limited to Au, Ag, Pt, Pd, Rh, Ir,Ru, Re, Si, Ni, NiSi_(x), NiCr_(x), Cu, CuSi_(x), CuGe_(x), CuAl_(x),CuN_(x), Co, CoSi_(x), CoCr_(x), Zn, ZnN_(x), Fe, FeNi_(x)Cr_(y), Cr,CrSi_(x) Al, AlN_(x), Ti, TiSi_(x), TiN_(x), Ta, TaSi_(x), TaN_(x), W,WSi_(x), WN_(x), Mo, MoSi_(x), MoN_(x), Zr, ZrSi_(x), ZrN_(x), Hf,HfSi_(x), HfN_(x), Nb, NbSi_(x), NbN_(x), V, VSi_(x), VN_(x), TiAl_(x),NiAl_(x), CoAl_(x), or any combination thereof.

Referring again to FIG. 10, the first electrode structure 124 and thesecond electrode structure 126 of the selector element 122 may have a“asymmetric” configuration, whereby the two electrode structures 124 and126 have different numbers of electrode layers and/or differentconductive materials for comparable electrode layers (e.g., the firstelectrode layer 124 a and the first electrode layer 126 a are made ofdifferent materials). The asymmetric configuration of the first andsecond electrode structures 124 and 126 may result in the selectorelement 122 exhibiting the asymmetric I-V response characteristics shownin FIG. 7 or FIG. 8. For example and without limitation, an asymmetricselector element 122 may comprise a first electrode structure 124 thatincludes a first electrode layer 124 a made of silver, a secondelectrode structure 126 that includes a first electrode layer 126 a madeof coper, and a volatile switching layer structure 128 including aplurality of silver particles or clusters 130 embedded in a hafniumoxide matrix 132 as illustrated in FIG. 11B or at least one layer ofsilver 134 interleaved with two or more layers of hafnium oxide 136 asillustrated in FIG. 11C. The second electrode structure 126 of the aboveexemplary asymmetric selector element may alternatively include a firstelectrode layer 126 a made of titanium nitride and a second electrodelayer 126 b made of silver. In an embodiment, the plurality ofmetal-rich particles or clusters 130 or the conductor layers 134 in thevolatile switching layer structure 128 are made of the same material asat least one electrode layer in at least one of the first and secondelectrode structures 124 and 126. For example and without limitation,the plurality of metal-rich particles or clusters 130 and the secondelectrode layer 126 b of the second electrode structure 126 both may bemade of Ag, Cu, Co, Ni, or any combination thereof.

The first electrode structure 124 and the second electrode structure 126of the selector element 122 may alternatively have a “symmetric”configuration, whereby the two electrode structures 124 and 126 have thesame number of electrode layers and the same conductive material forcomparable electrode layers (i.e., the first electrode layer 124 a andthe first electrode layer 126 a are made of the same material, thesecond electrode layer 124 b and the second electrode layer 126 b aremade of the same material, and so on). The symmetric configuration ofthe first and second electrode structures 124 and 126 may result in theselector element exhibiting the symmetric I-V response characteristicsshown in FIG. 5A or FIG. 5B.

In an embodiment for the selector element 122 with the symmetricelectrode configuration, the volatile switching layer structure 128includes a plurality of metal-rich particles or clusters 130 embedded ina matrix 132. The metal-rich particles or clusters 130 are made of Ag,Au, Ni, Cu, Co, As, or any combination thereof, while the matrix 132 ismade of HfO_(x), ZrO_(x), TiO_(x), NiO_(x), YO_(x), AlO_(x), MgO_(x),TaO_(x), SiO_(x), or any combination thereof. The volatile switchinglayer structure 128 may have an alternative structure that includes oneor more conductive layers 134 interleaved with two or more insulatinglayers 136. The conductive layers 134 are made of Ag, Au, Ni, Cu, Co,Ta, As, or any combination thereof, while the insulating layers 136 aremade of HfO_(x), ZrO_(x), TiO_(x), TaO_(x), NiO_(x), YO_(x), AlO_(x),MgO_(x), SiO_(x), or any combination thereof. The first and secondelectrode structures 124 and 126 of the selector element 122 with thesymmetric electrode configuration include the first electrode layers 124a and 126 a made of a material that may interact with defects or ions inthe volatile switching layer structure 128 in the presence of anelectric field, such as but not limited to Ag, Au, Ni, Cu, Co, Ta, Ti,Al, or any combination thereof, thereby acting as “active” electrodes.The first and second electrode structures 124 and 126 may furtherinclude the second electrode layers 124 b and 126 b that may berelatively inert with respect to the defects or ions in the volatileswitching layer structure 128, such as but not limited to Pt, Pd, Rh,Ir, Ru, Re, Ta, TiN_(x), ZrN_(x), HfN_(x), TaN_(x), NbN_(x), TiSi_(x),CoSi_(x), NiSi_(x), or any combination thereof, thereby acting as“inert” electrodes.

In another embodiment for the selector element 122 with the symmetricelectrode configuration, the volatile switching layer structure 128includes a plurality of metal-rich particles or clusters 130 embedded ina matrix 132. The metal-rich particles or clusters 130 are made of Ag,Au, Ni, Cu, Co, As, or any combination thereof, while the matrix 132 ismade of HfO_(x), ZrO_(x), TiO_(x), NiO_(x), YO_(x), AlO_(x), MgO_(x),TaO_(x), SiO_(x), or any combination thereof. The volatile switchinglayer structure 128 may have an alternative structure that includes oneor more conductive layers 134 interleaved with two or more insulatinglayers 136. The conductive layers 134 are made of Ag, Au, Ni, Cu, Co,Ta, As, or any combination thereof, while the insulating layers 136 aremade of HfO_(x), ZrO_(x), TiO_(x), TaO_(x), NiO_(x), YO_(x), AlO_(x),MgO_(x), SiO_(x), or any combination thereof. The first and secondelectrode structures 124 and 126 of the selector element 122 with thesymmetric electrode configuration include the first electrode layers 124a and 126 a made of a material that may be relatively inert and may notinteract with defects or ions in the volatile switching layer structure128 in the presence of an electric field, such as but not limited to Pt,Pd, Rh, Ir, Ru, Re, Ta, TiNX, ZrN_(x), HfN_(x), TaN_(x), NbN_(x),TiSi_(x), CoSi_(x), NiSi_(x), or any combination thereof; and the secondelectrode layers 124 b and 126 b that may act as active electrodes andare made of a material that may interact with defects or ions in thevolatile switching layer structure 128 in the presence of an electricfield, such as but not limited to Ag, Au, Ni, Cu, Co, Ta, Ti, Al, or anycombination thereof In addition to being relatively inert, the firstelectrode layers 124 a and 126 a may serve as diffusion barrier for themovement of defects or ions between the volatile switching layerstructure 128 and the second electrode layers 124 b and 126 b. The firstand second electrode structures 124 and 126 may further include thethird electrode layers 124 c and 126 c that may be relatively inert andmay not interact with defects or ions in the volatile switching layerstructure 128. For example and without limitation, the third electrodelayers 124 c and 126 c may be made of Pt, Pd, Rh, Ir, Ru, Re, Ta,TiN_(x), ZrN_(x), HfN_(x), TaN_(x), NbN_(x), TiSi_(x), CoSi_(x),NiSi_(x), or any combination thereof.

In still another embodiment for the selector element 122 with thesymmetric electrode configuration, the plurality of metal-rich particlesor clusters 130 or the conductive layers 134 in the volatile switchinglayer structure 128 are made of the same material as at least oneelectrode layer in the first and second electrode structures 124 and126. For example and without limitation, the plurality of metal-richparticles or clusters 130 and the second electrode layers 124 b and 126b may be made of Ag, Cu, Co, Ni, or any combination thereof.

FIG. 17A shows an exemplary structure 190 for the MTJ memory elementthat includes a magnetic free layer structure 200 and a magneticreference layer structure 202 with a tunnel junction layer 204interposed therebetween. The magnetic free layer structure 200 has avariable magnetization direction 206 substantially perpendicular to thelayer plane thereof. The magnetic reference layer structure 202 has afirst invariable magnetization direction 208 substantially perpendicularto the layer plane thereof. The magnetic free layer structure 200, thetunnel junction layer 204, and the magnetic reference layer structure202 collectively form a magnetic tunnel junction structure 210. Theexemplary structure 190 may further include a magnetic fixed layerstructure 212 exchange coupled to the magnetic reference layer structure202 through an anti-ferromagnetic coupling layer 214. The magnetic fixedlayer structure 212 has a second invariable magnetization direction 216that is substantially perpendicular to the layer plane thereof and issubstantially opposite to the first invariable magnetization direction208 of the magnetic reference layer structure 202. In an embodiment, theswitching voltage of the exemplary structure 190 from the low resistancestate to the high resistance state is substantially same as theswitching voltage from the high resistance state to the low resistancestate by adjusting the offset field, which is the net external magneticfield acting on the magnetic free layer structure 200 along thedirection of perpendicular magnetization 208. In another embodiment, thestray magnetic fields exerted on the magnetic free layer structure 200by the magnetic reference and fixed layer structures 202 and 212,respectively, substantially cancel each other, thereby rendering theoffset field to be substantially zero or negligible. The stacking orderof the layers 212, 214, 202, 204, and 200 in the exemplary structure 190may be inverted as shown in FIG. 17B.

Another exemplary structure 220 for the MTJ memory element, asillustrated in FIG. 17C, includes the magnetic tunnel junction structure210 and a magnetic compensation layer structure 222 separated from themagnetic free layer structure 200 by a non-magnetic spacer layer 224.The magnetic compensation layer structure 222 has a third invariablemagnetization direction 226 that is substantially perpendicular to thelayer plane thereof and is substantially opposite to the firstinvariable magnetization direction 208 of the magnetic reference layerstructure 202. The magnetic compensation layer structure 222 may be usedto generate a magnetic field opposing that exerted by the magnetic fixedlayer structure 202 on the magnetic free layer structure 200. In anembodiment, the switching voltage of the exemplary structure 220 fromthe low resistance state to the high resistance state is substantiallysame as the switching voltage from the high resistance state to the lowresistance state by adjusting the offset field. In another embodiment,the stray magnetic fields exerted on the magnetic free layer structure200 by the magnetic reference and compensation layer structures 202 and222, respectively, substantially cancel each other, thereby renderingthe offset field to be substantially zero or negligible. The stackingorder of the layers 202, 204, 200, 224, and 222 in the exemplarystructure 220 may be inverted as shown in FIG. 17D.

The magnetic free layer structure 200 of the exemplary structures 190,190′, 220, and 220′ may include one or more magnetic layers with eachlayer having the variable magnetization direction 206 as illustrated bythe exemplary embodiments shown in FIGS. 18A-18G. FIG. 18A shows thatthe magnetic free layer structure 200 includes a first magnetic freelayer 252, which has the variable magnetization direction 206, formedadjacent to the tunnel junction layer 204.

FIG. 18B shows the magnetic free layer structure 200 including a firstmagnetic free layer 252 formed adjacent to the tunnel junction layer 204and a second magnetic free layer 254 formed adjacent to the firstmagnetic free layer 252 opposite the tunnel junction layer 204. Each ofthe first and second magnetic free layers 252 and 254 has the variablemagnetization direction 206. The exemplary magnetic free layer structureof FIG. 18B may further include a non-magnetic perpendicular enhancementlayer (PEL) 258 interposed between the first and second magnetic freelayers 252 and 254 as illustrated in FIG. 18D.

The magnetic free layer structure 200 may include three magnetic freelayers 252-256 as illustrated in FIG. 18C. A first magnetic free layer252 is formed adjacent to the tunnel junction layer 204. A thirdmagnetic free layer 256 is formed adjacent to the first magnetic freelayer 252 opposite the tunnel junction layer 204. A second magnetic freelayer 254 is formed adjacent to the third magnetic free layer 256opposite the first magnetic free layer 252. Each of the first, second,and third magnetic free layers 252-256 has the variable magnetizationdirection 206.

The exemplary magnetic free layer structure of FIG. 18C may furtherinclude a non-magnetic perpendicular enhancement layer (PEL) 258interposed between the first and third magnetic free layers 252 and 256as illustrated in FIG. 18E. Alternatively, the exemplary magnetic freelayer structure of FIG. 18C may further include a non-magneticperpendicular enhancement layer (PEL) 258 interposed between the secondand third magnetic free layers 254 and 256 as illustrated in FIG. 18F.The exemplary magnetic free layer structure of FIG. 18F may be furthermodified to include a fourth magnetic free layer 260, which has thevariable magnetization direction 206, interposed between thenon-magnetic PEL 258 and the second magnetic free layer 254 asillustrated in FIG. 18G.

The exemplary magnetic free layer structures of FIGS. 18A-18G may beformed above the tunnel junction layer 204 as shown in FIGS. 17A and17C, or beneath the tunnel junction layer 204 as shown in FIGS. 17B and17D. In the latter case, the stacking sequence of the layers in theexemplary magnetic free layer structures of FIGS. 18A-18G will beinverted.

The magnetic free layer structure 200 is not limited to the exemplarystructures of FIGS. 18A-18G and may have other structures that includemultiple magnetic free layers and optionally one or more PELs. Forexample and without limitation, the magnetic free layer structure 200may include four magnetic free layers without any PEL.

The magnetic reference layer structure 202 of the exemplary structures190, 190′, 220, and 220′ may include one or more magnetic layers witheach layer having the first invariable magnetization direction 208 asillustrated by the exemplary embodiments shown in FIGS. 19A-19G. FIG.19A shows that the magnetic reference layer structure 202 includes afirst magnetic reference layer 262, which has the first invariablemagnetization direction 208, formed between the tunnel junction layer204. The anti-ferromagnetic coupling layer 214, if present, may formadjacent to the first magnetic reference layer 262.

FIG. 19B shows the magnetic reference layer structure 202 including afirst magnetic reference layer 262 formed adjacent to the tunneljunction layer 204 and a second magnetic reference layer 264 formedadjacent to the first magnetic reference layer 262 opposite the tunneljunction layer 204. The anti-ferromagnetic coupling layer 214, ifpresent, may form adjacent to the second magnetic reference layer 264opposite the first magnetic reference layer 262. Each of the first andsecond magnetic reference layers 262 and 264 has the first invariablemagnetization direction 208. The exemplary magnetic reference layerstructure of FIG. 19B may further include a non-magnetic perpendicularenhancement layer (PEL) 268 interposed between the first and secondmagnetic reference layers 262 and 264 as illustrated in FIG. 19D.

The magnetic reference layer structure 202 may include three magneticreference layers 262-266 as illustrated in FIG. 19C. A first magneticreference layer 262 is formed adjacent to the tunnel junction layer 204.A third magnetic reference layer 266 is formed adjacent to the firstmagnetic reference layer 262 opposite the tunnel junction layer 204. Asecond magnetic reference layer 264 is formed adjacent to the thirdmagnetic reference layer 266 opposite the first magnetic reference layer262. The anti-ferromagnetic coupling layer 214, if present, may formadjacent to the second magnetic reference layer 264 opposite the thirdmagnetic reference layer 266. Each of the first, second, and thirdmagnetic reference layers 262-266 has the first invariable magnetizationdirection 208.

The exemplary magnetic reference layer structure of FIG. 19C may furtherinclude a non-magnetic perpendicular enhancement layer (PEL) 268interposed between the first and third magnetic reference layers 262 and266 as illustrated in FIG. 19F. Alternatively, the exemplary magneticreference layer structure of FIG. 19C may further include a non-magneticperpendicular enhancement layer (PEL) 268 interposed between the secondand third magnetic reference layers 264 and 266 as illustrated in FIG.19E. The exemplary magnetic reference layer structure of FIG. 19E may befurther modified to include a fourth magnetic reference layer 270, whichhas the first invariable magnetization direction 208, interposed betweenthe non-magnetic PEL 268 and the second magnetic reference layer 264 asillustrated in FIG. 19G.

The exemplary magnetic reference layer structures of FIGS. 19A-19G maybe formed beneath the tunnel junction layer 204 as shown in FIGS. 17Aand 17C, or above the tunnel junction layer 204 as shown in FIGS. 17Band 17D. In the latter case, the stacking sequence of the layers in theexemplary magnetic reference layer structures of FIGS. 19A-19G will beinverted.

The magnetic reference layer structure 202 is not limited to theexemplary structures of FIGS. 19A-19G and may have other structures thatinclude multiple magnetic reference layers and optionally one or morePELs. For example and without limitation, the magnetic reference layerstructure 202 may include four magnetic reference layers without anyPEL.

The magnetic fixed layer structure 212 of the exemplary structures 190and 190′ may include one or more magnetic layers with each layer havingthe second invariable magnetization direction 216 as illustrated by theexemplary embodiments shown in FIGS. 20A-20G. FIG. 20A shows that themagnetic fixed layer structure 212 includes a first magnetic fixed layer272, which has the second invariable magnetization direction 216, formedadjacent to the anti-ferromagnetic coupling layer 214.

FIG. 20B shows the magnetic fixed layer structure 212 including a firstmagnetic fixed layer 272 formed adjacent to the anti-ferromagneticcoupling layer 214 and a second magnetic fixed layer 274 formed adjacentto the first magnetic fixed layer 272 opposite the anti-ferromagneticcoupling layer 214. Each of the first and second magnetic fixed layers272 and 274 has the second invariable magnetization direction 216. Theexemplary magnetic fixed layer structure of FIG. 20B may further includea non-magnetic perpendicular enhancement layer (PEL) 278 interposedbetween the first and second magnetic fixed layers 272 and 274 asillustrated in FIG. 20D.

The magnetic fixed layer structure 212 may include three magnetic fixedlayers 272-276 as illustrated in FIG. 20C. A first magnetic fixed layer272 is formed adjacent to the anti-ferromagnetic coupling layer 214. Athird magnetic fixed layer 276 is formed adjacent to the first magneticfixed layer 272 opposite the anti-ferromagnetic coupling layer 214. Asecond magnetic fixed layer 274 is formed adjacent to the third magneticfixed layer 276 opposite the first magnetic fixed layer 272. Each of thefirst, second, and third magnetic fixed layers 272-276 has the secondinvariable magnetization direction 216.

The exemplary magnetic fixed layer structure of FIG. 20C may furtherinclude a non-magnetic perpendicular enhancement layer (PEL) 278interposed between the first and third magnetic fixed layers 272 and 276as illustrated in FIG. 20F. Alternatively, the exemplary magnetic fixedlayer structure of FIG. 20C may further include a non-magneticperpendicular enhancement layer (PEL) 278 interposed between the secondand third magnetic fixed layers 274 and 276 as illustrated in FIG. 20E.The exemplary magnetic fixed layer structure of FIG. 20E may be furthermodified to include a fourth magnetic fixed layer 280, which has thesecond invariable magnetization direction 216, interposed between thenon-magnetic PEL 278 and the second magnetic fixed layer 274 asillustrated in FIG. 20G.

The exemplary magnetic fixed layer structures of FIGS. 20A-20G may beformed beneath the anti-ferromagnetic coupling layer 214 as shown inFIG. 17A, or above the anti-ferromagnetic coupling layer 214 as shown inFIG. 17B. In the latter case, the stacking sequence of the layers in theexemplary magnetic fixed layer structures of FIGS. 20A-20G will beinverted.

The magnetic fixed layer structure 212 is not limited to the exemplarystructures of FIGS. 20A-20G and may have other structures that includemultiple magnetic fixed layers and optionally one or more PELs. Forexample and without limitation, the magnetic fixed layer structure 212may include four magnetic fixed layers without any PEL.

The magnetic compensation layer structure 222 of the exemplarystructures 220 and 220′ may include one or more magnetic layers witheach layer having the third invariable magnetization direction 226 asillustrated by the exemplary structures shown in FIGS. 21A-21G. FIG. 21Ashows that the magnetic compensation layer structure 222 includes afirst magnetic compensation layer 282, which has the third fixedmagnetization direction 226, formed adjacent to the spacer layer 224.

FIG. 21B shows the magnetic compensation layer structure 222 including afirst magnetic compensation layer 282 formed adjacent to the spacerlayer 224 and a second magnetic compensation layer 284 formed adjacentto the first magnetic compensation layer 282 opposite the spacer layer224. Each of the first and second magnetic compensation layers 282 and284 has the third invariable magnetization direction 226. The exemplarymagnetic compensation layer structure of FIG. 21B may further include anon-magnetic perpendicular enhancement layer (PEL) 288 interposedbetween the first and second magnetic compensation layers 282 and 284 asillustrated in FIG. 21D.

The magnetic compensation layer structure 222 may include three magneticcompensation layers 282-286 as illustrated in FIG. 21C. A first magneticcompensation layer 282 is formed adjacent to the spacer layer 224. Athird magnetic compensation layer 286 is formed adjacent to the firstmagnetic compensation layer 282 opposite the spacer layer 224. A secondmagnetic compensation layer 284 is formed adjacent to the third magneticcompensation layer 286 opposite the first magnetic compensation layer282. Each of the first, second, and third magnetic compensation layers282-286 has the third invariable magnetization direction 226.

The exemplary magnetic compensation layer structure of FIG. 21C mayfurther include a non-magnetic perpendicular enhancement layer (PEL) 288interposed between the first and third magnetic compensation layers 282and 286 as illustrated in FIG. 21E. Alternatively, the exemplarymagnetic compensation layer structure of FIG. 21C may further include anon-magnetic perpendicular enhancement layer (PEL) 288 interposedbetween the second and third magnetic compensation layers 284 and 286 asillustrated in FIG. 21F. The exemplary magnetic compensation layerstructure of FIG. 21F may be further modified to include a fourthmagnetic compensation layer 290, which has the third invariablemagnetization direction 226, interposed between the non-magnetic PEL 288and the second magnetic compensation layer 284 as illustrated in FIG.21G.

The exemplary magnetic compensation layer structures of FIGS. 21A-21Gmay be formed above the spacer layer 224 as shown in FIG. 17C, orbeneath the spacer layer 224 as shown in FIG. 17D. In the latter case,the stacking sequence of the layers in the exemplary magnetic free layerstructures of FIG. 21A-21G will be inverted.

The magnetic compensation layer structure 222 is not limited to theexemplary structures of FIGS. 21A-21G and may have other structures thatinclude multiple magnetic compensation layers and optionally one or morePELs. For example and without limitation, the magnetic compensationlayer structure 222 may include four magnetic compensation layerswithout any PEL.

The magnetic layers 252-256, 260-266, 270-276, 280-286, and 290 may bemade of any suitable magnetic materials or structures. One or more ofthe magnetic layers 252-256, 260-266, 270-276, 280-286, and 290 each maycomprise one or more ferromagnetic elements, such as but not limited tocobalt (Co), nickel (Ni), and iron (Fe), to form a suitable magneticmaterial, such as but not limited to Co, Ni, Fe, CoNi_(x), CoFe_(x),NiFe_(x), or CoNi_(x)Fe_(y). The suitable magnetic material for the oneor more of the magnetic layers 252-256, 260-266, 270-276, 280-286, and290 may further include one or more non-magnetic elements, such as butnot limited to boron (B), titanium (Ti), zirconium (Zr), hafnium (Hf),vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum(Mo), tungsten (W), aluminum (Al), silicon (Si), germanium (Ge), gallium(Ga), oxygen (0), nitrogen (N), carbon (C), platinum (Pt), palladium(Pd), ruthenium (Ru), samarium (Sm), neodymium (Nd), antimony (Sb),iridium (Ir) or phosphorus (P), to form a magnetic alloy or compound,such as but not limited to cobalt-iron-boron (CoFe_(x)B_(y)),iron-platinum (FePt_(x)), cobalt-platinum (CoPt_(x)),cobalt-platinum-chromium (CoPt_(x)Cr_(y)), cobalt-iron-boron-titanium(CoFe_(x)B_(y)Ti_(z)), cobalt-iron-boron-zirconium,(CoFe_(x)B_(y)Zr_(z)), cobalt-iron-boron-hafnium (CoFe_(x)B_(y)Hf_(z)),cobalt-iron-boron-vanadium (CoFe_(x)B_(y)V_(z)),cobalt-iron-boron-tantalum (CoFe_(x)B_(y)Ta_(z)),cobalt-iron-boron-chromium (CoFe_(x)B_(y)Cr_(z)), cobalt-iron-titanium(CoFe_(x)Ti_(y)), cobalt-iron-zirconium (CoFe_(x)Zr_(y)),cobalt-iron-hafnium (CoFe_(x)Hf_(y)), cobalt-iron-vanadium(CoFe_(x)V_(y)), cobalt-iron-niobium (CoFe_(x)Nb_(y)),cobalt-iron-tantalum (CoFe_(x)Ta_(y)), cobalt-iron-chromium(CoFe_(x)Cr_(y)), cobalt-iron-molybdenum (CoFe_(x)Mo_(y)),cobalt-iron-tungsten (CoFe_(x)W_(y)), cobalt-iron-aluminum(CoFe_(x)Al_(y)), cobalt-iron-silicon (CoFe_(x)Si_(y)),cobalt-iron-germanium (CoFe_(x)Ge_(y)), iron-zirconium-boron(FeZr_(x)B_(y)), samarium-cobalt (SmCo_(x)), neodymium-iron-boron(NdFe_(x)B_(y)), cobalt-iron-antimony (CoFe_(x)Sb_(y)),cobalt-iron-iridium (CoFe_(x)Ir_(y)), or cobalt-iron-phosphorous(CoFe_(x)P_(y)).

Some of the above-mentioned magnetic materials, such as Fe, CoFe_(x),CoFe_(x)B_(y) may have a body-centered cubic (BCC) lattice structurethat is compatible with the halite-like cubic lattice structure ofMgO_(x), which may be used as the insulating tunnel junction layer 204.CoFe_(x)B_(y) alloy used for one or more of the magnetic layers 252-256,260-266, 270-276, 280-286, and 290 may contain more than 40 atomicpercent Fe or may contain less than 30 atomic percent B or both.

One or more of the magnetic layers 252-256, 260-266, 270-276, 280-286,and 290 each may alternatively have a multilayer structure formed byinterleaving one or more layers of a first type of material 292 with oneor more layers of a second type of material 294 with at least one of thetwo types of materials 292 and 294 b eing magnetic, as illustrated inFIGS. 22A-22D. FIG. 22A shows an exemplary multilayer structure formedby one (n=1) or more stacks of a bilayer unit structure 296, whichincludes a layer of the first type of material 292 and a layer of thesecond type of material 294. The multilayer structure for one or more ofthe magnetic layers 252-256, 260-266, 270-276, 280-286, and 290 mayinclude additional layers formed at the periphery of the exemplarymultilayer structure of FIG. 22A. For example and without limitation,the stacks of the bilayer unit structure 296 may include another layerof the second type of material 298 formed adjacent to the first type ofmaterial of the first stack as shown in FIG. 22B, or another layer ofthe first type of material 300 formed adjacent to the second type ofmaterial of the n^(th) stack (the end stack) as shown in FIG. 22C, orboth as shown in FIG. 22D. The layer of the first type of material 292in a unit structure 296 may have a different thickness compared withother layers of the first type of material in other unit structures.Similarly, the layer of the second type of material 294 in a unitstructure 296 may have a different thickness compared with other layersof the second type of material in other unit structures. The layerthicknesses of the first type of material 300 and the second type ofmaterial 298 at the periphery may or may not be same as the layerthicknesses of the first type of material 292 and the second type ofmaterial 294 of the bilayer unit structure 296, respectively. One ormore layers of the two layers of materials 292-294 may be extremely thinand thus have fragmented coverage and/or are perforated with holes. Thestacking sequences of the exemplary multilayer structures of FIGS.22A-22D may be inverted.

The first type of material 292 and 300 may comprise one or moreferromagnetic elements, such as but not limited to cobalt (Co), nickel(Ni), and iron (Fe), to form a suitable magnetic material, such as butnot limited to Co, Ni, Fe, CoNi_(x), CoFe_(x), NiFe_(x), orCoNi_(x)Fe_(y). The second type of material 294 and 298 may be made ofany suitable material, such as but not limited to Pt, Pd, Ni, Ir, Cr, V,Ti, Zr, Hf, Nb, Ta, Mo, W, NiCr_(x), NiVX, NiTi_(x), NiZr_(x), NiHf_(x),NiNb_(x), NiTa_(x), NiMo_(y), NiW_(x), or any combination thereof.Therefore, one or more of the magnetic layers 252-256, 260-266, 270-276,280-286, and 290 may include a multilayer structure, such as but notlimited to [Co/Pt], [Co/Pd], [Co/Pt(Pd)], [Co/Ni], [Co/Ir],[CoFe_(x)/Pt], [CoFe_(x)/Pd], [CoFe_(x)/Pt(Pd)], [CoFe_(x)/Ni],[CoFe_(x)/Ir], [Co/NiCr_(x)], or any combination thereof. The multilayerstructure may have a face-centered cubic (FCC) type of latticestructure, which is different from the body-centered cubic structure(BCC) of some ferromagnetic materials, such as Fe, CoFe_(x), andCoFe_(x)B_(y), and the halite-like cubic lattice structure of magnesiumoxide (MgO_(x)) that may be used as the insulating tunnel junction layer204. All individual magnetic layers of a magnetic multilayer structuremay have the same magnetization direction. The multilayer structure mayor may not exhibit the characteristic satellite peaks associated withsuperlattice when analyzed by X-ray, neutron diffraction, or otherdiffraction techniques.

The insulating tunnel junction layer 204 of the exemplary structures190, 190′, 220 and 220′ in FIGS. 17A-17D, respectively, may be formed ofa suitable insulating material containing oxygen, nitrogen, or both,such as but not limited to magnesium oxide (MgO)_(x), aluminum oxide(AlO_(x)), titanium oxide (TiO_(x)), zirconium oxide (ZrO_(x)), hafniumoxide (HfO_(x)), vanadium oxide (VO_(x)), tantalum oxide (TaO_(x)),chromium oxide (CrO_(x)), molybdenum oxide (MoO_(x)), tungsten oxide(WO_(x)), gallium oxide (GaO_(x)), silicon oxide (SiO_(x)), yttriumoxide (YO_(x)), silicon nitride (SiN_(x)), MgTi_(x)O_(y), MgAl_(x)O_(y),AlTi_(x)O_(y), or any combination thereof. The insulating tunneljunction layer 204 may have a composite structure comprising two layersof insulating materials, each of which is made of a suitable insulatingmaterial as described above. For example and without limitation, thecomposite tunnel junction layer may include a layer of magnesium oxideand a layer of titanium oxide.

The anti-ferromagnetic coupling layer 214, which anti-ferromagneticallycouples the magnetic fixed layer structure 212 to the magnetic referencelayer structure 202 of the exemplary structures 190 and 190′ in FIGS.17A and 17B, respectively, may be made of a suitable coupling material,such as but not limited to ruthenium (Ru), vanadium (V), niobium (Nb),tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), manganese(Mn), rhenium (Re), osmium (Os), rhodium (Rh), iridium (Ir), copper(Cu), or any combination thereof. The anti-ferromagnetic coupling layer214 may have a composite structure that includes two or more sublayers.Each of the sublayers may be made of a suitable coupling materialdescribed above.

The perpendicular enhancement layers (PELs) 258, 268, 278, and 288 eachmay comprise one or more of the following elements: B, Mg, Ti, Zr, Hf,V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu,Ag, Au, Al, Si, Ge, Ga, O, N, and C, thereby forming a suitableperpendicular enhancement material, such as but not limited to B, Mg,Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Rh, Ir, Ni,Pd, Pt, Cu, Ag, Au, Al, Si, Ge, Ga, MgO, TiO_(x), ZrO_(x), HfO_(x),VO_(x), NbO_(x), TaO_(x), CrO_(x), MoO_(x), WO_(x), RhO_(x), NiO_(x),PdO_(x), PtO_(x), CuO_(x), AgO_(x), RuO_(x), SiO_(x), TiN_(x), ZrN_(x),HfN_(x), VN_(x), NbN_(x), TaN_(x), CrN_(x), MoN_(x), WN_(x), NiN_(x),PdN_(x), PtO_(x), RuN_(x), SiN_(x), TiO_(x)N_(y), ZrO_(x)N_(y),HfO_(x)N_(y), VO_(x)N_(y), NbO_(x)N_(y), TaO_(x)N_(y), CrO_(x)N_(y),MoO_(x)N_(y), WO_(x)N_(y), NiO_(x)N_(y), PdO_(x)N_(y), PtO_(x)N_(y),RuO_(x)N_(y), SiO_(x)N_(y), TiRu_(x)O_(y), ZrRu_(x)O_(y), HfRu_(x)O_(y),VRu_(x)O_(y), NbRu_(x)O_(y), TaRu_(x)O_(y), CrRu_(x)O_(x),MoRu_(x)O_(y), WRu_(x)O_(y), RhRu_(x)O_(y), NiRu_(x)O_(y),PdRu_(x)O_(y), PtRu_(x)O_(y), CuRu_(x)O_(y), AgRu_(x)O_(y),CoFe_(x)B_(y), CoFe_(x), NiFe_(x), CoFe_(x)Ni_(y), CoTi_(x), CoZr_(x),CoHf_(x), CoV_(x), CoNb_(x), CoTa_(x), CoFe_(x)Ta_(y), CoCr_(x),CoMo_(x), CoW_(x), NiCr_(x), NiTi_(x), NiZr_(x), NiHf_(x), NiV_(x),NiNb_(x), NiTa_(x), NiMo_(y), NiW_(x), CoNi_(x)Ta_(y), CoNi_(x)Cr_(y),CoNi_(x)Ti_(y), FeTi_(x), FeZr_(x), FeHf_(x), FeV_(x), FeNb_(x),FeTa_(x), FeCr_(x), FeMo_(x), FeW_(x), or any combination thereof. Incases where the perpendicular enhancement material contains one or moreferromagnetic elements, such as Co, Fe, and Ni, the total content of theferromagnetic elements of the perpendicular enhancement material may beless than the threshold required for becoming magnetic, therebyrendering the material essentially non-magnetic. Alternatively, theperpendicular enhancement material that contains one or moreferromagnetic elements may be very thin, thereby rendering the materialparamagnetic or magnetically dead. One or more of the PELs 258, 268,278, and 288 may alternatively have a multilayer structure comprisingtwo or more layers of perpendicular enhancement sublayers, each of whichis made of a suitable perpendicular enhancement material describedabove. For example and without limitation, one or more of the PELs 258,268, 278, and 288 may have a bilayer structure, such as but not limitedto W/Ta, Ta/W, Mo/Ta, Ta/Mo, W/Hf, Hf/W, Mo/Hf, or Hf/Mo.

FIG. 23A is a cross sectional view of a memory cell formed byintegrating the MTJ memory element having the exemplary structure 190shown in FIG. 17A and the selector element having the exemplarystructure 122 shown in FIG. 10. The second electrode structure 126 ofthe selector element 122 is formed adjacent to the magnetic fixed layerstructure 212. In some embodiments, the memory cell of FIG. 23A includesan optional interface layer structure 230 formed between the magneticfixed layer structure 212 and the second electrode structure 126. Theoptional interface layer structure 230 may include one or more interfacelayers with each layer being made of a suitable material, such as butnot limited to Ta, TaN_(x), Ru, Ir, Rh, Ti, TiN_(x), Zr, ZrN_(x), Hf,HfN_(x), V, VN_(x), Nb, NbN_(x), Cr, Mo, W, NiCr_(x), FeNi_(x)Cr_(y),NiTi_(x), NiTa_(x), NiZr_(x), NiHf_(x), NiV_(x), NiNb_(x), NiMo_(y),NiW_(x), TiSi_(x), NiSi_(x), CoSi_(x), CoCr_(x), CoTi_(x), CoTa_(x),CoZr_(x), CoHf_(x), CoV_(x), CoNb_(x), CoMo_(x), CoW_(x), MgO_(x), orany combination thereof. The one or more interface layers each mayalternatively have a multilayer structure with one or more layers of afirst material interleaved with one or more layers of a second material.The first material may be Co or Ni and the second material may be Cr,Mo, W, Ta, Nb, V, Ti, Zr, Hf, Ir, or Rh. For example and withoutlimitation, the optional interface layer structure 230 may include atantalum layer formed adjacent to the second electrode structure 126 anda [Ni/Ti] multilayer structure formed adjacent to the magnetic fixedlayer structure 212. Alternatively, the optional interface layerstructure 230 may include a tantalum layer formed adjacent to the secondelectrode structure 126 and a NiCr_(x)layer formed adjacent to themagnetic fixed layer structure 212. Still alternatively, the optionalinterface layer structure 230 may include a layer of tantalum nitride(TaN_(x)) or titanium nitride (TiN_(x)).

The exemplary MTJ memory element structure 190 of the memory cell shownin FIG. 23A may be replaced by the exemplary structure 190′ illustratedin FIG. 17B, thereby disposing the magnetic free layer structure 200adjacent to the second electrode structure 126.

The MTJ memory element having the exemplary structure 190 shown in FIG.17A and the selector element having the exemplary structure 122 shown inFIG. 10 may be alternatively integrated by disposing the first electrodestructure 124 of the selector element 122 adjacent to the magnetic freelayer structure 220 as shown in FIG. 23B. In some embodiments, thememory cell of FIG. 23B includes an optional interface layer structure232 between the magnetic free layer structure 200 and the firstelectrode structure 124. The optional interface layer structure 232 mayinclude one or more interface layers with each layer being made of asuitable material, such as but not limited to Ta, TaN_(x), Ru, Ir, Rh,Ti, TiNX, Zr, ZrN_(x), Hf, HfN_(x), V, VN, Nb, NbN_(x), Cr, Mo, W,NiCr_(x), FeNi_(x)Cr_(y), NiTi_(x), NiTa_(x), NiZr_(x), NiHf_(x),NiV_(x), NiNb_(x), NiMo_(y), NiW_(x), TiSi_(x), NiSi_(x), CoSi_(x),CoCr_(x), CoTi_(x), CoTa_(x), CoZr_(x), CoHf_(x), CoV_(x), CoNb_(x),CoMo_(x), CoW_(x), MgO_(x), or any combination thereof. The one or moreinterface layers each may alternatively have a multilayer structure withlayers of a first material interleaved with layers of a second material.The first material may be Co or Ni and the second material may be Cr,Mo, W, Ta, Nb, V, Ti, Zr, Hf, Ir, or Rh. For example, the optionalinterface layer structure 232 may include an MgO_(x)layer formedadjacent to the magnetic free layer structure 200 and a ruthenium (Ru)layer formed adjacent to the first electrode structure 124.Alternatively, the optional interface layer structure 232 may include atantalum layer formed adjacent to the first electrode structure 124 anda ruthenium layer formed adjacent to the magnetic free layer structure200. Still alternatively, the optional interface layer structure 232 mayinclude multiple layers with one MgO_(x)layer formed adjacent to themagnetic free layer structure 200. Yet alternatively, the optionalinterface layer structure 232 may include a layer of tantalum nitride(TaN_(x)) or titanium nitride (TiN_(x)).

The exemplary MTJ memory element structure 190 of the memory cell shownin FIG. 23B may be replaced by the exemplary structure 190′ illustratedin FIG. 17B, thereby disposing the magnetic fixed layer structure 212adjacent to the first electrode structure 124.

FIG. 23C is a cross sectional view of a memory cell formed byintegrating the MTJ memory element having the exemplary structure 220shown in FIG. 17C and the selector element having the exemplarystructure 122 shown in FIG. 10. The second electrode structure 126 ofthe selector element 122 is formed adjacent to the magnetic referencelayer structure 202. In some embodiments, the memory cell of FIG. 23Cincludes the optional interface layer structure 230 between the magneticreference layer structure 202 and the second electrode structure 126.The exemplary MTJ memory element structure 220 of the memory cell shownin FIG. 23C may be replaced by the exemplary structure 220′ illustratedin FIG. 17D, thereby disposing the magnetic compensation layer structure222 adjacent to the second electrode structure 126.

The MTJ memory element having the exemplary structure 220 shown in FIG.17C and the selector element having the exemplary structure 122 shown inFIG. 10 may be alternatively integrated by disposing the first electrodestructure 124 of the selector element 122 adjacent to the magneticcompensation layer structure 222 as shown in FIG. 23D. In someembodiments, the memory cell of FIG. 23D includes the optional interfacelayer structure 232 between the magnetic compensation layer structure222 and the first electrode structure 124. The exemplary MTJ memoryelement structure 220 of the memory cell shown in FIG. 23D may bereplaced by the exemplary structure 220′ illustrated in FIG. 17D,thereby disposing the magnetic reference layer structure 202 adjacent tothe first electrode structure 124.

The magnetic memory cells shown in FIGS. 23A and 23C may be fabricatedby deposition the layers 124-128 corresponding to the selector element122 on substrates or wafers and followed by deposition of the magneticmemory element structures 190 and 220 on the selector element 122.Likewise, the magnetic memory cells shown in FIGS. 23B and 23D may befabricated by deposition of the layers corresponding to the magneticmemory element structures 190 and 220 on substrates or wafers andfollowed by deposition of the films corresponding to the selectorelement 122 on the magnetic memory element structures 190 and 220.

While the present invention has been shown and described with referenceto certain preferred embodiments, it is to be understood that thoseskilled in the art will no doubt devise certain alterations andmodifications thereto which nevertheless include the true spirit andscope of the present invention. Thus the scope of the invention shouldbe determined by the appended claims and their legal equivalents, ratherthan by examples given.

1. A memory cell comprising: a magnetic tunnel junction (MTJ) memoryelement including: a magnetic free layer structure including one or moremagnetic free layers having a variable magnetization directionsubstantially perpendicular to layer planes thereof; a magneticreference layer structure one or more magnetic reference layers having afirst invariable magnetization direction substantially perpendicular tolayer planes thereof; and an insulating tunnel junction layer interposedbetween said magnetic free layer structure and said magnetic referencelayer structure; and a two-terminal selector element coupled to said MTJmemory element in series, said two-terminal selector element including:a first electrode; a second electrode; and volatile switching layerinterposed between said first and second electrodes, said volatileswitching layer including multiple oxide layers interleaved with one ormore metal layers.
 2. The memory cell of claim 1, wherein said multipleoxide layers comprise hafnium and oxygen.
 3. The memory cell of claim 1,wherein at least one of said first and second electrodes comprisessilver.
 4. The memory cell of claim 1, wherein said one or more metallayers and said first and second electrodes are made of a same material.5. The memory cell of claim 1, wherein said one or more metal layers andsaid first and second electrodes comprise silver.
 6. The memory cell ofclaim 1, wherein said two-terminal selector element further includes: athird electrode formed between said volatile switching layer and saidfirst electrode; and a fourth electrode formed between said volatileswitching layer and said second electrode.
 7. The memory cell of claim6, wherein at least one of said third and fourth electrodes comprisestitanium nitride.
 8. The memory cell of claim 1, wherein said MTJ memoryelement further includes a magnetic fixed layer structure exchangedcoupled to said magnetic reference layer structure through ananti-ferromagnetic coupling layer, said magnetic fixed layer structurehaving a second invariable magnetization direction that is substantiallyperpendicular to a layer plane thereof and is opposite to said firstinvariable magnetization direction.
 9. The memory cell of claim 1,wherein at least one of said first and second electrodes comprises oneof copper, cobalt, or nickel.
 10. The memory cell of claim 1, whereinsaid one or more metal layers comprise one of silver, copper, cobalt, ornickel.
 11. The memory cell of claim 1, wherein said volatile switchinglayer is in physical contact with said first and second electrodes. 12.The memory cell of claim 1, wherein at least one of said one or moremetal layers has discontinuous film coverage.
 13. The memory cell ofclaim 6, wherein said volatile switching layer is in physical contactwith said third and fourth electrodes.
 14. The memory cell of claim 6,wherein at least one of said third and fourth electrodes comprises oneof tantalum nitride, titanium silicide, nickel silicide, or cobaltsilicide.
 15. The memory cell of claim 6, wherein said first and secondelectrodes are active electrodes and said third and fourth electrodesare inert electrodes.
 16. A memory cell comprising: a magnetic tunneljunction (MTJ) memory element including: a magnetic free layer structureincluding one or more magnetic free layers having a variablemagnetization direction substantially perpendicular to layer planesthereof; a magnetic reference layer structure including one or moremagnetic reference layers having a first invariable magnetizationdirection substantially perpendicular to layer planes thereof; and aninsulating tunnel junction layer interposed between said magnetic freelayer structure and said magnetic reference layer structure; and atwo-terminal selector element coupled to said MTJ memory element inseries, said two-terminal selector element including: a first electrode;a second electrode; and a volatile switching layer interposed betweensaid first and second electrodes, said volatile switching layerincluding multiple hafnium oxide layers interleaved with one or moresilver layers, wherein at least one of said first and second electrodescomprises silver.
 17. The memory cell of claim 16, wherein at least oneof said one or more silver layers has discontinuous film coverage. 18.The memory cell of claim 16, wherein said two-terminal selector elementfurther includes: a third electrode formed between said volatileswitching layer and said first electrode; and a fourth electrode formedbetween said volatile switching layer and said second electrode, whereinat least one of said third and fourth electrodes comprises titaniumnitride.
 19. A memory cell comprising: a magnetic tunnel junction (MTJ)memory element including: a magnetic free layer structure including oneor more magnetic free layers having a variable magnetization directionsubstantially perpendicular to layer planes thereof; a magneticreference layer structure including one or more magnetic referencelayers having a first invariable magnetization direction substantiallyperpendicular to layer planes thereof; and an insulating tunnel junctionlayer interposed between said magnetic free layer structure and saidmagnetic reference layer structure; and a two-terminal selector elementcoupled to said MTJ memory element in series, said two-terminal selectorelement including: a first electrode; a second electrode; and a volatileswitching layer interposed between said first and second electrodes,said volatile switching layer including multiple hafnium oxide layersinterleaved with one or more nickel layers, wherein at least one of saidfirst and second electrodes comprises nickel.
 20. The memory cell ofclaim 19, wherein at least one of said one or more nickel layers hasdiscontinuous film coverage.